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NB3L553DR2G - onsemi

Description: Clock / Data Fanout Buffer, 2.5 V / 3.3 V / 5.0 V 1:4

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NB3L553DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NB3L553DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NB3L553DR2G Details

  • Manufacturer Part Number:

    NB3L553DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V OR 5V SUPPLY

  • Family:

    3L

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.035 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    85 mA

  • Prop. Delay@Nom-Sup:

    5 ns

  • Propagation Delay (tpd):

    5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    200 MHz

NB3L553DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3L553DR2G involves keeping the input and output tracks as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper decoupling, place a 10uF ceramic capacitor between the VIN pin and the GND pin, and a 1uF ceramic capacitor between the VOUT pin and the GND pin. These capacitors should be placed as close to the device as possible.
  • The NB3L553DR2G can handle input voltages up to 5.5V, but it's recommended to keep the input voltage below 5V to ensure reliable operation and to prevent damage to the device.
  • The NB3L553DR2G is rated for operation up to 125°C, but it's recommended to keep the junction temperature below 115°C to ensure reliable operation and to prevent damage to the device.
  • To troubleshoot issues with the NB3L553DR2G, check the input voltage, output voltage, and output current. Verify that the device is properly decoupled and that the PCB layout is correct. Also, check for any signs of overheating or physical damage to the device.

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NB3L553DR2G Overview

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