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NB3L553MNR4G - onsemi

Description: ON SEMICONDUCTOR - NB3L553MNR4G - CLOCK FANOUT BUFFER, 200MHZ, DFN-8

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NB3L553MNR4G - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN8 2X2 CASE 506AA ISSUEE
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NB3L553MNR4G - onsemi  - 3D model - Small Outline No-lead - DFN8 2X2 CASE 506AA ISSUEE
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NB3L553MNR4G Details

  • Manufacturer Part Number:

    NB3L553MNR4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN8 2.0x2.0x0.9mm, 0.5p

  • Package Description:

    SO-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    506AA

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V OR 5V SUPPLY

  • Family:

    3L

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    S-XDSO-N8

  • Length:

    2 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.035 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    85 mA

  • Prop. Delay@Nom-Sup:

    5 ns

  • Propagation Delay (tpd):

    5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

  • fmax-Min:

    200 MHz

NB3L553MNR4G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3L553MNR4G involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and power-down of the NB3L553MNR4G, it's recommended to follow a controlled power-up sequence, where the input voltage is ramped up slowly (typically 1-2 ms) to prevent inrush currents. During power-down, the input voltage should be ramped down slowly as well to prevent voltage spikes.
  • The NB3L553MNR4G has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. This can be achieved by using a heat sink, improving air flow, and reducing power consumption.
  • To minimize EMI with the NB3L553MNR4G, it's recommended to use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or chokes on the input and output lines.
  • The NB3L553MNR4G is a high-reliability device with a mean time between failures (MTBF) of over 100,000 hours. It's also qualified to automotive and industrial standards, such as AEC-Q100 and IEC 60747.

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