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NB3L8504SDTG - onsemi

Description: Four Differential LVDS Outputs; Each Differential Output has OE Control; 660 ps Max Output Rise and Fall Times, LVCMOS; Translates Differential Input to LVDS Levels; 700 MHz Maximum Output Frequency; 50 ps Maximum Output Skew; 350 ps Maximum Part−to−part Skew; 1.3 ns Maximum Propagation Delay; Operating Range: VCC = 2.375 V to 3.630 V; Additive Phase Jitter RMS: < 100 fs Typical; −40°C to +85°C Ambient Operating Temperature

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NB3L8504SDTG - onsemi - PCB symbol
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PCB Footprints
NB3L8504SDTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-16 CASE 948F-01 ISSUE B
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3D Models
NB3L8504SDTG - onsemi - 3D model - Small Outline Packages - TSSOP-16 CASE 948F-01 ISSUE B
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NB3L8504SDTG Details

  • Manufacturer Part Number:

    NB3L8504SDTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-16

  • Manufacturer Package Code:

    948F-01

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    IT ALSO OPERATE ON 3.3V SUPPLY

  • Family:

    NB3

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    1.3 ns

  • Propagation Delay (tpd):

    1.3 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    2.5625 V

  • Supply Voltage-Min (Vsup):

    2.4375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    700 MHz

NB3L8504SDTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3L8504SDTG involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and power-down of the NB3L8504SDTG, it's recommended to follow a controlled power-up sequence, where the input voltage is ramped up slowly (typically 1-2 ms) to prevent inrush currents. During power-down, the input voltage should be ramped down slowly as well.
  • The NB3L8504SDTG has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as a thermal pad or a heat sink, to keep the junction temperature below the maximum rating.
  • To troubleshoot issues with the NB3L8504SDTG, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly powered up and that the input and output capacitors are properly sized. Use an oscilloscope to check for oscillations or noise on the output.
  • Yes, the NB3L8504SDTG is suitable for high-reliability applications. It's manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its specified parameters.

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