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NB3N2302DG - onsemi

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NB3N2302DG - onsemi - PCB symbol
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PCB Footprints
NB3N2302DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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NB3N2302DG - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NB3N2302DG Details

  • Manufacturer Part Number:

    NB3N2302DG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    0.150 INCH, LEAD FREE, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    3N

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.35 ns

  • Propagation Delay (tpd):

    0.35 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    133 MHz

NB3N2302DG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3N2302DG involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V power supply, and the VEE pin to a stable -3.3V power supply. The input common-mode voltage should be within the range of VEE + 1.5V to VCC - 1.5V. Additionally, ensure that the input signals are within the recommended common-mode voltage range.
  • The maximum allowable power dissipation for the NB3N2302DG is 500mW. To ensure reliable operation, the device should be operated within the recommended operating conditions, and the junction temperature should not exceed 150°C.
  • The NB3N2302DG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • The NB3N2302DG is designed to operate up to 3.2 GHz, but the recommended operating frequency range is up to 2.5 GHz for optimal performance and minimal signal degradation.

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NB3N2302DG Overview

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