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NB3N5573DTG - onsemi

Description: HCSL Differential Output; Typical Period RMS jitter of 1.5 ps; Uses 25 MHz Fundamental Mode Parallel Resonant Crystal; Industrial Temperature Range -40C to +85C; Operating Range 3.3 V +/- 10%; PCIe Gen1, Gen2, Gen3, Gen4, QPI, UPI Jitter Compliant

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NB3N5573DTG Details

  • Manufacturer Part Number:

    NB3N5573DTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-16

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    948F-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Clock Frequency-Max:

    200 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    25 MHz

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    135 mA

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, OTHER

NB3N5573DTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3N5573DTG involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 0.1uF capacitor to ground. The input voltage (VIN) should be within the recommended range (2.7V to 5.5V). Additionally, ensure the output is properly terminated with a 50Ω load.
  • The NB3N5573DTG can support data rates up to 3.2 Gbps, making it suitable for high-speed applications such as HDMI, DisplayPort, and USB 3.0.
  • To prevent ESD damage, handle the device by the body or use an anti-static wrist strap. Ensure the PCB has ESD protection diodes and follow proper ESD handling procedures during assembly and testing.
  • The NB3N5573DTG has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a heat sink or thermal pad, and avoid overheating the device during operation.

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NB3N5573DTG Overview

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Clock Generator, 200MHz, CMOS, PDSO16