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NB3V1104CDTR2G - onsemi

Description: Very Low Output−to−Output Skew < 50 ps; Supply Voltage: 3.3 V, 2.5 V or 1.8 V; Available in 8−Pin TSSOP; Operating Temperature Range: –40°C to 105°C; Low Additive Jitter; fmax = 250 MHz for 3.3 V; fmax = 180 MHz for 2.5 V; fmax = 133 MHz for 1.8 V; These Devices are Pb−Free and are RoHS Compliant; High−Performance 1:4 LVCMOS Clock Buffer

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NB3V1104CDTR2G - onsemi - PCB symbol
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PCB Footprints
NB3V1104CDTR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−8 CASE 948S−01 ISSUE C
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NB3V1104CDTR2G - onsemi - 3D model - Small Outline Packages - TSSOP−8 CASE 948S−01 ISSUE C
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NB3V1104CDTR2G Details

  • Manufacturer Part Number:

    NB3V1104CDTR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-8

  • Manufacturer Package Code:

    948S-01

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.75

  • Additional Feature:

    ALSO OPERATES AT 2.5V AND 3.3V VCC NOMINAL SUPPLY

  • Family:

    NB3V

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    3.5 ns

  • Same Edge Skew-Max (tskwd):

    0.075 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    250 MHz

NB3V1104CDTR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB3V1104CDTR2G involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper powering and decoupling, use a low-ESR capacitor (e.g., 0.1 μF) connected between VCC and GND, and a larger capacitor (e.g., 10 μF) connected between VCC and GND for bulk decoupling. Place these capacitors as close to the device as possible.
  • The NB3V1104CDTR2G can operate up to 1.5 GHz, but the maximum frequency of operation depends on the specific application and the quality of the PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • The NB3V1104CDTR2G has a thermal pad on the bottom of the package. To ensure proper thermal management, use a thermal interface material (e.g., thermal tape or thermal grease) between the thermal pad and a heat sink or a metal plate on the PCB. Keep the surrounding area clear of components to ensure good airflow.
  • The recommended input and output termination for the NB3V1104CDTR2G is 50 Ω. Use a series resistor (e.g., 50 Ω) at the input and output to match the impedance and prevent signal reflections.

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NB3V1104CDTR2G Overview

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