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NB3W1200LMNTXG - onsemi

Description: 12 Differential Clock Output Pairs @ 0.7 V; Low−Power NMOS Push−Pull Compatible Outputs for NB3W1200L; Optimized 100 MHz and 133 MHz Operating Frequencies to Meet The Next Generation PCIe Gen 2/Gen 3/ Gen 4 and Intel QPI & UPI Phase Jitter; DB1200ZL Compliant; 3.3 V ±5% Supply Voltage Operation; Fixed−Feedback for Lowest Input−To−Output Delay Variation; SMBus Programmable Configurations to Allow Multiple Buffers in a Single Control Network; PLL Bypass Configurable for PLL or Fanout Operation; Programmable P

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NB3W1200LMNTXG - onsemi - PCB symbol
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PCB Footprints
NB3W1200LMNTXG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN64 9x9, 0.5P (PUNCH & SAWN)
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3D Models
NB3W1200LMNTXG - onsemi - 3D model - Quad Flat No-Lead - QFN64 9x9, 0.5P (PUNCH & SAWN)
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NB3W1200LMNTXG Details

  • Manufacturer Part Number:

    NB3W1200LMNTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN-64

  • Package Description:

    QFN-64

  • Manufacturer Package Code:

    485DH

  • Country Of Origin:

    India

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.05

  • Family:

    NB3

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of True Outputs:

    24

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    4.5 ns

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

NB3W1200LMNTXG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal protection circuits or thermal sensors to monitor the device temperature.
  • A 10uF ceramic capacitor with X7R or X5R dielectric should be placed as close as possible to the device's power pins. Additional 1uF and 0.1uF capacitors can be added in parallel to filter out high-frequency noise.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Ensure that the ESD protection devices are rated for the maximum voltage and current of the device.
  • Use a soldering iron with a temperature of 260°C (500°F) and a dwell time of 3-5 seconds. For rework, use a hot air rework station with a temperature of 220°C (428°F) and a dwell time of 10-15 seconds.

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NB3W1200LMNTXG Overview

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NB3W1200LMNTXG Alternates

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Part Image NB3W1200LMNG onsemi

Low Skew Clock Driver, NB3 Series, 24 True Output(s), 0 Inverted Output(s), QCC64