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NB4L858MFAG - onsemi

Description: ON Semiconductor NB4L858MFAG, Crosspoint Switch, Dual 2 x 2 2.5 V, 3.3 V, 32-Pin LQFP

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NB4L858MFAG - onsemi PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP FA SUFFIX CASE 873A-02 ISSUE B
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NB4L858MFAG - onsemi  - 3D model - Quad Flat Packages - LQFP FA SUFFIX CASE 873A-02 ISSUE B
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NB4L858MFAG Details

  • Manufacturer Part Number:

    NB4L858MFAG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    7 X 7 MM, LEAD FREE, PLASTIC, LQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    873A-02

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    IT CAN ALSO OPERATE WITH 2.5V SUPPLY

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NO/NC

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

NB4L858MFAG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB4L858MFAG should prioritize thermal management, minimize parasitic inductance, and ensure a low-impedance path for the output. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Keep the input and output capacitors close to the device, and use a thermal pad for heat dissipation.
  • For the input capacitor, choose a low-ESR capacitor with a value between 10uF to 22uF. For the output capacitor, choose a low-ESR capacitor with a value between 10uF to 47uF. The capacitor selection should be based on the specific application requirements, such as ripple current, voltage rating, and physical size.
  • The NB4L858MFAG is rated for operation up to 125°C junction temperature. However, for reliable operation, it's recommended to keep the ambient temperature below 105°C to ensure a sufficient thermal margin.
  • The NB4L858MFAG requires a bias voltage of 5V to 12V on the VCC pin. Ensure the bias voltage is stable and within the recommended range to maintain optimal performance and prevent damage to the device.
  • The recommended input voltage range for the NB4L858MFAG is 2.7V to 5.5V. Operating the device outside this range may affect its performance, efficiency, or reliability.

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