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NB4N11MDTG - onsemi

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Symbol
NB4N11MDTG - onsemi - PCB symbol
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PCB Footprints
NB4N11MDTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-8 CASE948R-02 ISSUE A
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3D Models
NB4N11MDTG - onsemi - 3D model - Small Outline Packages - TSSOP-8 CASE948R-02 ISSUE A
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NB4N11MDTG Details

  • Manufacturer Part Number:

    NB4N11MDTG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    948R-02

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    35 mA

  • Prop. Delay@Nom-Sup:

    0.6 ns

  • Propagation Delay (tpd):

    0.6 ns

  • Same Edge Skew-Max (tskwd):

    0.025 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NB4N11MDTG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB4N11MDTG should prioritize minimizing parasitic inductance and capacitance. Keep the device close to the power plane, use short and wide traces, and avoid vias under the device. A 4-layer PCB with a solid ground plane is recommended. Consult the onsemi application note AND8323/D for more details.
  • The NB4N11MDTG requires a bias voltage of 5V to 15V. Ensure the bias voltage is stable and within the recommended range. A decoupling capacitor (e.g., 100nF) should be placed close to the device to filter out noise. Consult the datasheet for more information on biasing and decoupling.
  • The NB4N11MDTG has an operating temperature range of -40°C to 150°C. However, the device's performance may degrade at extreme temperatures. Ensure proper thermal management and consider derating the device's performance at high temperatures.
  • Yes, the NB4N11MDTG is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is manufactured using a qualified process. However, ensure you follow the recommended design and testing guidelines for your specific application.
  • The NB4N11MDTG has an integrated ESD protection diode, but it's still important to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap, mat, or workstation, and ensure the device is stored in an ESD-safe environment.

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NB4N11MDTG Overview

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