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NB6L11DG - onsemi

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NB6L11DG - onsemi - PCB symbol
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PCB Footprints
NB6L11DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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NB6L11DG - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NB6L11DG Details

  • Manufacturer Part Number:

    NB6L11DG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    BGA-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

  • Family:

    6L

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    20 mA

  • Prop. Delay@Nom-Sup:

    0.22 ns

  • Propagation Delay (tpd):

    0.2 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.015 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NB6L11DG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB6L11DG involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to follow the recommended voltage and current settings outlined in the datasheet. Typically, this involves setting the input voltage to 3.3V or 5V, and ensuring the output current does not exceed the maximum rating of 1.5A. Additionally, it's recommended to use a voltage regulator to regulate the input voltage and ensure a stable output.
  • The NB6L11DG has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum power for extended periods. Additionally, follow the recommended PCB layout guidelines to minimize thermal resistance and ensure efficient heat dissipation.
  • To troubleshoot issues with the NB6L11DG, start by verifying the input voltage and current, and ensuring the device is properly biased. Check for any signs of overheating, and verify that the output voltage is within the recommended range. Use an oscilloscope to monitor the output voltage and current, and check for any signs of oscillation or instability. If issues persist, consult the datasheet and application notes for further guidance.
  • Yes, the NB6L11DG is a high-frequency device and requires careful consideration of EMI/EMC. Ensure that the PCB layout is designed to minimize radiation and susceptibility, and follow best practices for shielding and filtering. Additionally, use a common-mode choke and a ferrite bead to filter out high-frequency noise and ensure compliance with relevant EMI/EMC standards.

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NB6L11DG Overview

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