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NB6LQ572MNG - onsemi

Description: NB6LQ572MNG, Clock Generator CML, LVDS, LVPECL LVPECL 4-Input, 32-Pin QFN

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PCB Footprints
NB6LQ572MNG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN-32
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3D Models
NB6LQ572MNG - onsemi  - 3D model - Quad Flat No-Lead - QFN-32
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NB6LQ572MNG Details

  • Manufacturer Part Number:

    NB6LQ572MNG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    5 X 5 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, QFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    488AM

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO OPERATES AT 3.3 V

  • Delay-Max:

    10 ns

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    PECL TO LVPECL TRANSCEIVER

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    110 mA

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

NB6LQ572MNG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NB6LQ572MNG should prioritize signal integrity, minimize parasitic inductance, and ensure proper power supply decoupling. Use a 4-layer PCB with a solid ground plane, and place the device close to the power supply. Keep the signal traces short and away from the power supply lines. Refer to onsemi's application notes and layout guidelines for more information.
  • To ensure the NB6LQ572MNG operates within its recommended operating conditions, monitor the device's junction temperature (TJ) and keep it below the maximum rating of 150°C. Also, ensure the power supply voltage (VCC) is within the recommended range of 2.5V to 3.6V, and the input signals are within the specified voltage levels. Use thermal management techniques, such as heat sinks or thermal pads, if necessary.
  • The NB6LQ572MNG is a high-speed differential receiver capable of operating at data transfer rates up to 6.25 Gbps. However, the actual data transfer rate depends on the system design, PCB layout, and signal quality. To achieve the maximum data transfer rate, ensure the signal integrity is maintained, and the device is operated within its recommended specifications.
  • To troubleshoot issues with the NB6LQ572MNG, start by reviewing the device's datasheet and application notes. Check the PCB layout, signal integrity, and power supply quality. Use oscilloscopes or signal analyzers to monitor the signal waveforms and identify any anomalies. Verify that the device is operated within its recommended specifications, and consult onsemi's technical support resources or application notes for guidance.
  • Yes, the NB6LQ572MNG is a sensitive device and requires proper ESD protection measures to prevent damage. Use ESD-safe handling and storage procedures, and ensure the device is properly grounded during assembly. Implement ESD protection circuits, such as TVS diodes or ESD protection arrays, in the system design to protect the device from electrostatic discharge.

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