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NBSG14MNG - onsemi

Description: Clock Buffer 2.5V/3.3V SiGE 1:4 Diff Clock w/RSECL

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NBSG14MNG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NBSG14MNG
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NBSG14MNG - onsemi  - 3D model - Quad Flat No-Lead - NBSG14MNG
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NBSG14MNG Details

  • Manufacturer Part Number:

    NBSG14MNG

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    LEAD FREE, QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    485G-01

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    RSNECL MODE: VCC = 0 V WITH VEE = -2.375 V TO -3.465 V

  • Family:

    14

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N16

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    SERIES-RESISTOR

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    75 mA

  • Prop. Delay@Nom-Sup:

    0.15 ns

  • Propagation Delay (tpd):

    0.16 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.015 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • fmax-Min:

    10500 MHz

NBSG14MNG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and ensure proper grounding and decoupling. Implement EMI filters and shielding on the PCB if necessary.
  • Use a low-ESR capacitor for decoupling, minimize lead inductance, and ensure a low-impedance power supply. Optimize the PCB layout for minimal parasitic inductance and capacitance.
  • Use a 4-wire Kelvin connection for low-current measurements. Ensure proper probe placement and a low-noise measurement environment. Calibrate the measurement equipment regularly.

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NBSG14MNG Overview

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