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NCD57001FDWR2G - onsemi

Description: High Current Output(+4/-6 A) at IGBT Miller Plateau Voltages; DESAT with Soft Turn Off; Short Propagation Delays with Accurate Matching; Active Miller Clamp and Negative Gate Voltage; High Transient & Electromagnetic Immunity; 5 kV Galvanic Isolation

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NCD57001FDWR2G - onsemi - PCB symbol
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PCB Footprints
NCD57001FDWR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−16 WB CASE 751G ISSUE Ess
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3D Models
NCD57001FDWR2G - onsemi - 3D model - Small Outline Packages - SOIC−16 WB CASE 751G ISSUE Ess
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NCD57001FDWR2G Details

  • Manufacturer Part Number:

    NCD57001FDWR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-16W

  • Package Description:

    SOIC-16

  • Manufacturer Package Code:

    751G-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Date Of Intro:

    2020-07-20

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    7.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    24 V

  • Supply Voltage1-Min:

    12.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.09 µs

  • Turn-on Time:

    0.09 µs

  • Width:

    7.5 mm

NCD57001FDWR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a heat sink or thermal pad, and consider using a thermal interface material (TIM) to improve heat transfer. Additionally, ensure good airflow and avoid overheating the device.
  • Exceeding the maximum junction temperature (Tjmax) can lead to reduced device lifespan, increased thermal resistance, and potentially cause permanent damage or failure. It's essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • While the NCD57001FDWR2G is not specifically designed for high-humidity environments, it can still be used with proper precautions. Ensure the device is properly sealed, use a conformal coating, and follow recommended storage and handling procedures to minimize moisture exposure.
  • The recommended soldering profile for the NCD57001FDWR2G involves a peak temperature of 260°C (500°F) for a maximum of 10 seconds, with a ramp-up rate of 3°C/s (5.4°F/s) and a ramp-down rate of 6°C/s (10.8°F/s). Ensure the soldering process is performed in a controlled environment to prevent damage.

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NCD57001FDWR2G Overview

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