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NCD5702DR2G - onsemi

Description: Low Impedance VOH and VOL; Active Miller Clamp; DESAT Protection with Programmable Delay; High Current Output (+4.0/-6.0 A) at IGBT Miller Plateau voltages

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NCD5702DR2G Details

  • Manufacturer Part Number:

    NCD5702DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Built-in Protections:

    TRANSIENT; UNDER VOLTAGE

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    9.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    7.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Min:

    13.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.075 µs

  • Turn-on Time:

    0.075 µs

  • Width:

    3.9 mm

NCD5702DR2G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a thermal interface material (TIM) to improve heat transfer between the device and the heat sink. Also, ensure good airflow around the device.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Power up the device in the following sequence: VCC, then VIN. Ensure that VCC is stable before applying VIN. This sequence helps prevent latch-up and ensures reliable operation.

Trust Checks

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NCD5702DR2G Overview

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