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NCD57200DR2G - onsemi

Description: High Peak Current Output (+1.9 A / -2.3 A); Reliable Operation for Vs Negative Swing to -800V; Dead-time & Interlock protection; Galvanic Isolated High Side Driver; CMTI up to 50 kV/us; Secured Output Low State without VDD/VB; VDD/VB Supply Range up to 20 V

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Symbol
NCD57200DR2G - onsemi - PCB symbol
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PCB Footprints
NCD57200DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 NB
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3D Models
NCD57200DR2G - onsemi - 3D model - Small Outline Packages - SOIC−8 NB
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NCD57200DR2G Details

  • Manufacturer Part Number:

    NCD57200DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Date Of Intro:

    2019-12-19

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    2.3 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    20 V

  • Supply Voltage1-Nom:

    10 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.11 µs

  • Turn-on Time:

    0.11 µs

  • Width:

    4 mm

NCD57200DR2G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum TJ. Monitor the device's thermal status using the thermal monitoring pin (TMP) or an external temperature sensor.
  • The device has internal ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected package.
  • Yes, the NCD57200DR2G is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is manufactured using a process that is compliant with the IATF 16949 standard.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the device's power supply voltage and ensure it is within the recommended range. Verify that the device is properly configured and that the input signals are within the recommended specifications.

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NCD57200DR2G Overview

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