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NCD57201DR2G - onsemi

Description: Reliable Operation for Vs Negative Swing to -800V; Galvanic Isolated High Side Driver; Dead-time & Interlock protection; CMTI up to 50 kV/us; Secured Output Low State without VDD/VB; VDD/VB Supply Range up to 20 V; High Peak Current Output (+1.9 A / -2.3 A)

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NCD57201DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOC_NB
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NCD57201DR2G - onsemi  - 3D model - Small Outline Packages - SOC_NB
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NCD57201DR2G Details

  • Manufacturer Part Number:

    NCD57201DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED IGBT DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    2.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    11 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    820 V

  • Supply Voltage1-Min:

    -810 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.11 µs

  • Turn-on Time:

    0.11 µs

  • Width:

    3.9 mm

NCD57201DR2G Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the PCB.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal pad to reduce the junction temperature, and ensure good airflow around the device.
  • To prevent ESD damage, it is recommended to handle the device with an anti-static wrist strap or mat, and to use ESD-protected equipment during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to the PCB design.
  • The NCD57201DR2G is not hermetically sealed, so it is not recommended for use in high-humidity environments. If operation in a humid environment is required, consider using a conformal coating or potting the device to protect it from moisture.
  • The recommended soldering conditions for the NCD57201DR2G are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 217°C or higher.

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