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NCH-RSL10-101WC51-ABG - onsemi

Description: Ultra-Low-Power: - Industry's lowest power consumption in Deep Sleep Mode (62.5 nW) and Rx in Receive Mode (7 mW) - Industry's best EEMBC® ULPMark™ scores (1090 ULPMark CP @ 3 V; 1260 @ 2.1 V); Advanced Multi-Protocol Wireless Functionality: - Rx Sensitivity: - 94 dBM - Transmitting Power: -17 to +6 dBm - Supports Bluetooth Low Energy and 2.4 GHz proprietary/custom protocols - Supports Firmware Over The Air (FOTA); Flexible Voltage Supply Range (1.1 and 3.3 V): Supports devices using 1.2 and 1.5 V batteries

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NCH-RSL10-101WC51-ABG - onsemi - PCB symbol
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PCB Footprints
NCH-RSL10-101WC51-ABG - onsemi PCB footprint - Other - Other - WLCSP51, 2.364x2.325 CASE 567MT ISSUE A_2021
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NCH-RSL10-101WC51-ABG - onsemi - 3D model - Other - WLCSP51, 2.364x2.325 CASE 567MT ISSUE A_2021
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NCH-RSL10-101WC51-ABG Details

  • Manufacturer Part Number:

    NCH-RSL10-101WC51-ABG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-51

  • Manufacturer Package Code:

    567MT

  • Country Of Origin:

    Singapore

  • Factory Lead Time:

    30 Weeks

  • Date Of Intro:

    2017-02-22

  • Manufacturer:

    onsemi

  • Data Rate:

    2000 Mbps

  • JESD-30 Code:

    R-PBGA-B51

  • JESD-609 Code:

    e2

  • Length:

    2.364 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    51

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA51,11X11,10

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.381 mm

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.252 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.325 mm

NCH-RSL10-101WC51-ABG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use a 50-ohm impedance-controlled line. Refer to the onsemi application note for more details.
  • Ensure good thermal conductivity by using a thermal pad or a heat sink, and avoid blocking airflow around the device. Monitor the device temperature using the internal temperature sensor or an external thermometer.
  • Power up the device in the following sequence: VDD, then VBAT, and finally enable the radio. This ensures proper initialization and prevents damage to the device.
  • Use a 50-ohm antenna with a good impedance match to the device. Optimize the antenna design using simulation tools or empirical methods to achieve the best radiation pattern and efficiency.
  • Use a 32.768 kHz crystal with a load capacitance of 12-15 pF. Ensure the crystal is properly matched to the device's oscillator circuitry, and follow the onsemi application note for more details.

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NCH-RSL10-101WC51-ABG Overview

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