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NCL30060B3DR2G - onsemi

Description: Obsolete - High Power Factor Offline Single Stage LED Driver, with High Voltage Startup

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NCL30060B3DR2G Details

  • Manufacturer Part Number:

    NCL30060B3DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-7

  • Manufacturer Package Code:

    751U

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-10

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G7

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP7/8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.7 mA

  • Supply Voltage-Max:

    28 V

  • Supply Voltage-Min:

    11.75 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCL30060B3DR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the copper traces as short and wide as possible to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the derating guidelines provided in the datasheet, use a heat sink or thermal interface material, and ensure good airflow around the device. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and take corrective action if necessary.
  • Operating the device at a lower voltage than the recommended 60V may reduce the maximum output current and affect the device's efficiency. However, it can also reduce the power losses and heat generation, which may be beneficial in certain applications. Consult the datasheet and application notes for more information on operating the device at lower voltages.
  • To troubleshoot issues with the device, start by checking the input voltage, output voltage, and output current to ensure they are within the recommended specifications. Check the PCB layout and thermal design to ensure they meet the recommended guidelines. Use a thermal camera or thermometer to check the device temperature, and consult the datasheet and application notes for troubleshooting guides and FAQs.
  • Yes, the NCL30060B3DR2G is a high-frequency switching regulator, and as such, it can generate electromagnetic interference (EMI). To minimize EMI, follow the recommended PCB layout guidelines, use a shielded inductor, and consider adding EMI filters or shielding to the device. Consult the datasheet and application notes for more information on EMI/EMC considerations.

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