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NCL30105DR2G - onsemi

Description: Constant off time current mode control; Adjustable off time (0.5 to 10 µs); Internal leading edge blanking; ± 5% current sense accuracy; Internal Startup Delay; Soft Start; PWM or Analog Dimming Control; Maximum on time protection; Overcurrent protection; Thermal Shutdown

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PCB Footprints
NCL30105DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 8, 150 mils
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3D Models
NCL30105DR2G - onsemi  - 3D model - Small Outline Packages - SOIC 8, 150 mils
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NCL30105DR2G Details

  • Manufacturer Part Number:

    NCL30105DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCL30105DR2G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • A soft-start circuit can be implemented to limit the inrush current during start-up. A capacitor can be added in series with the input voltage to slow down the voltage rise time.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device.
  • The device is rated for operation up to 150°C. However, the maximum operating temperature may be limited by the specific application and PCB design. Derating the device's power dissipation may be necessary for high-temperature operation.
  • Use a shielded inductor, keep the switching node (SW) as short as possible, and use a common-mode choke to reduce EMI. Additionally, follow good PCB layout practices, such as separating the power and signal planes.

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NCL30105DR2G Overview

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