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NCN26010XMNTXG - onsemi

Description: Enhanced Noise Immunity Mode: - ENI extends the noise immunity to values well above the IEEE T1S standard - Allows the NCN26010 to withstand worst-case DPI and BCI immunity tests - Significantly improves the network reach when enabled, almost 2X better than competition - Unique to NCN26010; Lowest Line Pin Capacitance: - Best-in-class line pin capacitance allows for the highest number of nodes per segment. - The NCN26010 supports up to 40 nodes on a 25-meter segment, well above the IEEE minimum standard - L

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NCN26010XMNTXG - onsemi - PCB symbol
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PCB Footprints
NCN26010XMNTXG - onsemi PCB footprint - Other - Other - 4mm x 4mm QFN
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NCN26010XMNTXG - onsemi - 3D model - Other - 4mm x 4mm QFN
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NCN26010XMNTXG Details

  • Manufacturer Part Number:

    NCN26010XMNTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN32 4x4, 0.4P

  • Package Description:

    QFN-32

  • Manufacturer Package Code:

    485GH

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    27 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.65

  • Data Rate:

    10000 Mbps

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.16SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

NCN26010XMNTXG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection and overcurrent protection circuits.
  • Critical timing parameters include the input rise and fall times, and the output delay. Ensure that the device is driven by a signal source with a fast rise and fall time, and that the output is properly terminated to prevent reflections.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-resistant components and connectors.
  • Use a high-speed oscilloscope and a signal generator to test the device. Measure the input and output waveforms, and verify that the device meets the specified timing and voltage parameters.

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NCN26010XMNTXG Overview

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