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NCN3411MTTWG - onsemi

Description: Obsolete - Data Switch, 6-Differential Channel 1:2 Switch for PCIe 3.0 and Display Port 1.2

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PCB Footprints
NCN3411MTTWG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WQFN42 3.5x9 CASE 510AP-01 ISSUE O
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NCN3411MTTWG - onsemi  - 3D model - Quad Flat No-Lead - WQFN42 3.5x9 CASE 510AP-01 ISSUE O
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NCN3411MTTWG Details

  • Manufacturer Part Number:

    NCN3411MTTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WQFN42, 3.5x9, 0.5P

  • Package Description:

    WQFN-42

  • Pin Count:

    42

  • Manufacturer Package Code:

    510AP

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    R-XQCC-N42

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    42

  • Off-state Isolation-Nom:

    58 dB

  • On-state Resistance Match-Nom:

    0.35 Ω

  • On-state Resistance-Max (Ron):

    13 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC42,.14X.35,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Signal Current-Max:

    0.12 A

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    8 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

NCN3411MTTWG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF values, and for output capacitors, use 10uF to 47uF values.
  • Use a shielded enclosure, keep the device and its components away from the PCB edge, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.

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NCN3411MTTWG Overview

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