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NCN5120MNTWG - onsemi

Description: • Replaced by NCN5121 • 9600 baud KNX Communication Speed • Supervision of KNX Bus Voltage • Supports Bus Current Consumption up to 13 and 26 mA • Selectable KNX Bus Current (0.5 mA/ms and 1.0 mA/ms) • High Efficient DC−DC Converters ♦ 3.3 V Fixed ♦ 3.3 V to 21 V Selectable • Control and Monitoring of Power Regulators • Linear 20 V Regulator • Prepared for Sleep Mode • Buffering of Sent Data Frames (Extended Frames Supported) • Selectable UART or SPI Interface to Host Controller • Selectable UA

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PCB Footprints
NCN5120MNTWG - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN40 6x6, 0.5P_
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NCN5120MNTWG - onsemi  - 3D model - Quad Flat No-Lead - QFN40 6x6, 0.5P_
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NCN5120MNTWG Details

  • Manufacturer Part Number:

    NCN5120MNTWG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN40 6x6, 0.5P, 3.2x3.2EP

  • Package Description:

    QFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    485AU

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    37 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

NCN5120MNTWG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Critical timing parameters include the input rise and fall times, output delay, and clock-to-output delay. Refer to the datasheet for specific values and ensure proper signal integrity.
  • Implement ESD protection using TVS diodes or ESD arrays on the input and output pins. Ensure proper PCB layout and routing to minimize ESD susceptibility.
  • Power up the device in the following sequence: VCC, then VDD. Ensure a slow voltage ramp-up (10-20 ms) to prevent latch-up and damage.

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NCN5120MNTWG Overview

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