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NCN6004AFTBR2G - onsemi

Description: Obsolete - SIM Card Supply and Level Shifter

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PCB Footprints
NCN6004AFTBR2G - onsemi PCB footprint - Quad Flat Packages - Quad Flat Packages - 48 LEADS, TQFP EP CASE 932F−01 ISSUE A
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3D Models
NCN6004AFTBR2G - onsemi  - 3D model - Quad Flat Packages - 48 LEADS, TQFP EP CASE 932F−01 ISSUE A
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NCN6004AFTBR2G Details

  • Manufacturer Part Number:

    NCN6004AFTBR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP / 48 LEADS, TQFP EP 7x7x1 mm

  • Package Description:

    TQFP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    932F-01

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

NCN6004AFTBR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the IC and to connect it to a heat sink or a thermal plane.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper PCB design guidelines for thermal management.
  • The NCN6004AFTBR2G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and avoid touching the device's pins or exposed pads. For PCB design, consider adding ESD protection diodes or resistors to sensitive inputs.
  • The NCN6004AFTBR2G is designed to operate in a variety of environments, including those with high vibration. However, it's essential to follow proper PCB design and assembly guidelines to ensure the device is securely attached to the board and can withstand the vibration. Consider using a rigid PCB material and a robust mounting method.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage and current, as well as the output voltage and current. Check for any signs of overheating, and ensure that the device is properly configured and connected. Use an oscilloscope to monitor the output voltage and current, and consult the datasheet for specific troubleshooting guidelines.

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NCN6004AFTBR2G Overview

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Part Image NCN6004AFTBR2 onsemi

Interface Circuit, PQFP48