Description:Built−in 700 V MOSFET with RDS(on) of 34 Ω; Large Creepage Distance Between High−voltage Pins; Adjustable Peak Current up to 250 mA; Direct Feedback connection for non-isolated converter; Internal and Adjustable Over Power Protection (OPP) Circuit; Auto-Recovery Output Short Circuit Protection with Timer-Based Detection; Frequency Jittering (including during frequency foldback mode); Current−Mode Fixed Frequency Operation – 60 or 100 kHz (130 kHz on demand); Frequency Foldback Operation; With (A version) or
A recommended PCB layout for the NCP1060BD060R2G includes a thermal pad connected to a large copper area on the PCB, with multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, keeping the component placement and routing symmetrical can help reduce thermal gradients.
To ensure proper biasing, connect the EN pin to a voltage source (e.g., VCC) through a 10kΩ resistor. The EN pin should be pulled up to the desired voltage level (e.g., 3.3V or 5V) to enable the device. Additionally, ensure the input voltage (VIN) is within the recommended range (6.5V to 18V) and the output voltage (VOUT) is set to the desired level using the FB pin.
Critical components to consider when designing a power supply using the NCP1060BD060R2G include the input capacitor (CIN), output capacitor (COUT), and inductor (L). Choose components with suitable voltage and current ratings, and ensure the inductor has a high saturation current rating to handle peak currents.
To troubleshoot issues with the NCP1060BD060R2G, start by verifying the PCB layout and component selection. Check for proper decoupling, correct component values, and ensure the input and output capacitors are suitable for the application. Use an oscilloscope to measure the output voltage and current, and check for signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting and optimization.
Key considerations for thermal management when using the NCP1060BD060R2G include ensuring good airflow, using a heat sink or thermal interface material, and optimizing the PCB layout for thermal dissipation. The device's junction temperature (TJ) should be kept below 150°C to ensure reliable operation.
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NCP1060BD060R2G Overview
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