Description:Built−in 700 V MOSFET with RDS(on) of 11.4 Ω; Large Creepage Distance Between High−voltage Pins; Adjustable Peak Current up to 650 mA; Direct Feedback connection for non-isolated converter; Internal and Adjustable Over Power Protection (OPP) Circuit; Auto-Recovery Output Short Circuit Protection with Timer-Based Detection; Frequency Jittering (including during frequency foldback mode); Current−Mode Fixed Frequency Operation – 60 or 100 kHz (130 kHz on demand); Frequency Foldback Operation; AC Input Voltage
The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the component placement and routing symmetrical can help to reduce thermal gradients.
To ensure reliable start-up of the converter, it is recommended to add a soft-start circuit to limit the inrush current during start-up, and to use a high-quality input capacitor with low ESR to filter out noise and voltage transients. Additionally, the input voltage should be ramped up slowly to prevent excessive inrush current.
The maximum allowed output capacitance for stable operation depends on the specific application and operating conditions. As a general rule, the output capacitance should be limited to 10uF to 22uF to prevent oscillations and ensure stable operation. However, it is recommended to consult the application note and perform stability analysis to determine the optimal output capacitance for the specific design.
To protect the device from overvoltage and undervoltage conditions, it is recommended to add overvoltage protection (OVP) and undervoltage protection (UVP) circuits to the design. The OVP circuit can be implemented using a zener diode and a resistor, while the UVP circuit can be implemented using a voltage supervisor IC.
The recommended input filter design for EMI compliance involves using a pi-filter (L-C-L) or a T-filter (L-C-R-L) configuration with a common-mode choke and X-capacitors. The filter components should be selected based on the specific application and operating frequency, and the filter should be designed to meet the required EMI standards such as CISPR 22 or FCC Part 15.
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NCP1063AD100R2G Overview
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