Description:Integrated 700 V MOSFET with RDS(on) of 2.7 Ω; Current-Mode Fixed Frequency Operation (65 & 100 kHz) - 130 kHz for B version only; Peak Current: NCP1079A/B = 1,050mA; Skip-Cycle Operation at Low Peak Current; Dynamic Self-Supply (DSS); Auto-Recovery Output Short Circuit Protection with Timer-Based Detection; Frequency Foldback Operation; 300 µA No Load Power Consumption; Frequency Jittering (including during frequency foldback mode); Adjustable Brown-out Protection and OVP; Over Power Protection; 2nd Level
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable startup and shutdown, make sure to follow the recommended startup and shutdown sequences, use a soft-start circuit to limit inrush current, and add a UVLO (Under-Voltage Lockout) circuit to prevent the device from operating at low input voltages.
Critical components that affect EMI performance include the input filter, output filter, and PCB layout. Using a pi-filter or a common-mode choke at the input, and a LC filter at the output can help reduce EMI. Additionally, keeping the PCB layout compact and using a shielded enclosure can also improve EMI performance.
To optimize the device for low standby power consumption, use a low-standby-current controller, disable unnecessary features, and use a low-power mode or shutdown mode when the device is not in use. Additionally, using a high-efficiency transformer and optimizing the output voltage can also help reduce standby power consumption.
Recommended test and measurement equipment for characterizing the device include an oscilloscope, a signal generator, a DC power supply, a current probe, and a thermal camera. These tools can help measure parameters such as output voltage, current, and temperature, as well as EMI and efficiency.
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NCP1079AAP065G Overview
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