Description:Integrated 700 V MOSFET with RDS(on) of 2.7 Ω; Current-Mode Fixed Frequency Operation (65 & 100 kHz) - 130 kHz for B version only; Peak Current: NCP1079A/B = 1,050mA; Skip-Cycle Operation at Low Peak Current; Dynamic Self-Supply (DSS); Auto-Recovery Output Short Circuit Protection with Timer-Based Detection; Frequency Foldback Operation; 300 µA No Load Power Consumption; Frequency Jittering (including during frequency foldback mode); Adjustable Brown-out Protection and OVP; Over Power Protection; 2nd Level
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or perform thermal simulations to optimize the design.
To ensure reliable start-up and operation with a wide input voltage range, it's essential to follow the recommended input capacitor selection and voltage rating. The input capacitor should be rated for the maximum input voltage and have a low ESR to minimize voltage drops. Additionally, the device's internal voltage regulator should be bypassed with a capacitor to ensure stable operation.
To prevent overheating, it's essential to monitor the device's junction temperature (TJ), input voltage, output current, and output voltage. The TJ can be estimated using the device's thermal resistance and power dissipation. The input voltage and output current should be monitored to prevent overvoltage and overcurrent conditions, which can lead to overheating.
The output capacitor selection depends on the output voltage, output current, and ripple requirements. A low-ESR capacitor with a high ripple current rating is recommended. The capacitor's voltage rating should be higher than the output voltage, and its capacitance value should be sufficient to maintain the output voltage ripple within the desired limits.
To ensure EMI and EMC compliance, it's essential to follow good design practices such as using a solid ground plane, minimizing loop areas, and using shielded cables. The device's switching frequency should be kept below 100 kHz to minimize EMI radiation. Additionally, the device's output should be filtered using a pi-filter or an LC filter to reduce EMI emissions.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NCP1079BBP130G Overview
Use the download button to access the NCP1079BBP130G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NCP10,
or try a keyword search, such as Switching Regulator or Controllers
