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NCP110AFCT120T2G - onsemi

Description: LDO Regulator, 200 mA, Low Vin, Ultra-High PSRR, 1.1 V to 5.5 V,0.6 V to 4.0 V,70 mV for 1.05 V @ 100 mA,−0.3 to 6 V −55 to 150 °C

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NCP110AFCT120T2G - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.64x0.64x0.33 CASE 567VS ISSUE O
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NCP110AFCT120T2G - onsemi  - 3D model - BGA - WLCSP4, 0.64x0.64x0.33 CASE 567VS ISSUE O
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NCP110AFCT120T2G Details

  • Manufacturer Part Number:

    NCP110AFCT120T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567VS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-10-30

  • Manufacturer:

    onsemi

  • YTEOL:

    7.2

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.19 V

  • Dropout Voltage1-Nom:

    0.11 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.7 V

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e3

  • Length:

    0.64 mm

  • Line Regulation-Max:

    0.000912%

  • Load Regulation-Max:

    0.002388%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    1.236 V

  • Output Voltage1-Min:

    1.164 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    0.64 mm

NCP110AFCT120T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 2.5 mm x 2.5 mm, and connecting it to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet, and to ensure good thermal design and heat sinking.
  • The maximum allowed voltage on the input pins is 6.5V, which is the absolute maximum rating. However, it is recommended to operate the device within the recommended operating conditions specified in the datasheet to ensure reliable operation.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output load, and feedback resistors for correct values and connections. Also, verify that the device is properly bypassed and that the output capacitor is of sufficient value and type.
  • Yes, the NCP110AFCT120T2G is suitable for use in switching power supply designs, but it is recommended to follow the guidelines and recommendations provided in the datasheet and application notes to ensure reliable operation and to meet the required safety and regulatory standards.

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