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NCP130BMX120TCG - onsemi

Description: Ultra-Low Dropout of Typ. 75mV; Fixed Output Voltage options from 0.8V to 2.1V; 75 mV typical dropout at the full 300 mA load.; Guaranteed Output Current from 0mA to 300mA; 0.5% Typical Output Voltage Accuracy; Output Current in Excess of 300mA; Output Active Discharge option available

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PCB Footprints
NCP130BMX120TCG - onsemi PCB footprint - Other - Other - XDFN6_CASE 711AT
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NCP130BMX120TCG - onsemi  - 3D model - Other - XDFN6_CASE 711AT
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NCP130BMX120TCG Details

  • Manufacturer Part Number:

    NCP130BMX120TCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN-6

  • Manufacturer Package Code:

    711AT

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.15 V

  • Dropout Voltage1-Nom:

    0.075 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.35 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    1.2 mm

  • Line Regulation-Max:

    0.00498%

  • Load Regulation-Max:

    0.0015%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    1.218 V

  • Output Voltage1-Min:

    1.182 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.05,16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    1.5%

  • Width:

    1.2 mm

NCP130BMX120TCG Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP130BMX120TCG should ensure that the input and output capacitors are placed close to the device, and that the high-frequency loops are minimized. A 4-layer PCB with a solid ground plane is recommended. The datasheet provides a recommended PCB layout, but it's also a good idea to consult with onsemi's application notes and layout guidelines.
  • To ensure reliable start-up and operation with a wide input voltage range, it's essential to follow the recommended input capacitor selection and voltage rating. The input capacitor should be able to handle the maximum input voltage and have a low ESR to minimize voltage drops. Additionally, the device's internal voltage regulator should be bypassed with a capacitor to ensure stable operation.
  • The maximum output current capability of the NCP130BMX120TCG is 1.2A. However, the actual output current capability may be limited by the thermal performance of the device and the PCB. It's essential to ensure that the device is properly heatsinked and that the PCB is designed to handle the maximum output current.
  • To optimize the NCP130BMX120TCG for low standby power consumption, it's essential to ensure that the device is in shutdown mode when not in use. This can be achieved by connecting the EN pin to a logic low signal. Additionally, the input voltage should be minimized, and the output voltage should be set to the minimum required value. The device's quiescent current can also be reduced by using a low-value resistor in the feedback network.
  • The NCP130BMX120TCG has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to keep the device junction temperature below this limit. This can be achieved by using a heat sink, ensuring good airflow, and minimizing the thermal resistance between the device and the heat sink. The device's thermal performance can be estimated using the thermal resistance values provided in the datasheet.

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