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NCP137AFCTADJT2G - onsemi

Description: Ultra-Low Dropout of Typ. 40mV; Adjustable Voltage version; 40 mV typical dropout at the full 700 mA load.; Guaranteed Output Current from 0mA to 700mA; 0.5% Typical Output Voltage Accuracy; Output Current in Excess of 700mA; Output Active Discharge option available

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PCB Footprints
NCP137AFCTADJT2G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.20x0.80
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NCP137AFCTADJT2G - onsemi  - 3D model - BGA - WLCSP6, 1.20x0.80
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NCP137AFCTADJT2G Details

  • Manufacturer Part Number:

    NCP137AFCTADJT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Package Description:

    WLCSP-6

  • Manufacturer Package Code:

    567MV

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2016-07-26

  • Manufacturer:

    onsemi

  • YTEOL:

    9.4

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.06 V

  • Dropout Voltage1-Nom:

    0.04 V

  • Input-Output Voltage Differential-Max:

    4.5 V

  • Input-Output Voltage Differential-Min:

    0.3 V

  • JESD-30 Code:

    R-PBGA-B6

  • Length:

    1.2 mm

  • Line Regulation-Max (%/V):

    0.01

  • Load Regulation-Max:

    0.19%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.7 A

  • Output Voltage1-Max:

    5 V

  • Output Voltage1-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.8 mm

NCP137AFCTADJT2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities at higher temperatures.
  • The high current capability of the NCP137AFCTADJT2G requires careful PCB design to ensure that the traces and vias can handle the high currents. This may involve using thicker traces, multiple vias, and ensuring good thermal design.
  • To protect the device from overvoltage and overcurrent conditions, consider using overvoltage protection (OVP) and overcurrent protection (OCP) circuits, such as zener diodes and current-sensing resistors, respectively.
  • The NCP137AFCTADJT2G is a high-frequency device, and as such, it can generate electromagnetic interference (EMI) and radio-frequency interference (RFI). To mitigate this, use proper shielding, grounding, and filtering techniques in the PCB design.

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