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NCP137BFCTADJT2G - onsemi

Description: Obsolete - Controller, Quasi-Resonant Current Mode

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NCP137BFCTADJT2G - onsemi - PCB symbol
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PCB Footprints
NCP137BFCTADJT2G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE A
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NCP137BFCTADJT2G - onsemi - 3D model - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE A
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NCP137BFCTADJT2G Details

  • Manufacturer Part Number:

    NCP137BFCTADJT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WLCSP-6

  • Package Description:

    WLCSP-6

  • Manufacturer Package Code:

    567MV

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2016-07-26

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.06 V

  • Dropout Voltage1-Nom:

    0.04 V

  • Input-Output Voltage Differential-Max:

    4.5 V

  • Input-Output Voltage Differential-Min:

    0.3 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e3

  • Length:

    1.2 mm

  • Line Regulation-Max (%/V):

    0.01

  • Load Regulation-Max:

    0.19%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.7 A

  • Output Voltage1-Max:

    5 V

  • Output Voltage1-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.8 mm

NCP137BFCTADJT2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the device temperature within the recommended operating range.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the recommended voltage, current, and temperature ranges to guarantee reliable operation and prevent premature failure.
  • To troubleshoot issues related to the device's power-on reset (POR) function, check the power supply voltage, ensure that the POR pin is properly connected, and verify that the device is not experiencing any voltage drops or brownouts during power-up. Also, review the POR timing and ensure that it meets the recommended specifications.
  • The NCP137BFCTADJT2G has built-in ESD protection and latch-up prevention measures, including ESD diodes and clamp circuits. However, it's still essential to follow proper ESD handling and storage procedures to prevent damage to the device. Additionally, ensure that the device is properly soldered and that there are no electrical overstress conditions during operation.

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