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NCP1392DDR2G - onsemi

Description: Minimum frequency adjust accuracy 3 %; Brown-out input; 100 ms PFC delay timer ; 1 A / 0.5 A Peak Current Sink / Source Drive ; Fixed Dead Time Available in 0.3 us, 0.6 us, & 1.1 us

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PCB Footprints
NCP1392DDR2G - onsemi PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - SOIC−8 NB CASE 751−07 ISSUE AK
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3D Models
NCP1392DDR2G - onsemi  - 3D model - SOT23 (8-Pin) - SOIC−8 NB CASE 751−07 ISSUE AK
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NCP1392DDR2G Details

  • Manufacturer Part Number:

    NCP1392DDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.75

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    1 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    600 V

  • Supply Voltage1-Nom:

    16 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.5 µs

  • Turn-on Time:

    0.5 µs

  • Width:

    3.9 mm

NCP1392DDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1392DDR2G involves placing the input capacitors close to the VIN pin, using a solid ground plane, and keeping the high-frequency switching node (SW pin) away from sensitive analog circuits. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • Choose input capacitors with low ESR and high ripple current rating. For output capacitors, choose ones with low ESR and high capacitance. The recommended capacitance values are 10uF to 22uF for the input capacitor and 22uF to 47uF for the output capacitor.
  • The maximum ambient temperature range for the NCP1392DDR2G is -40°C to 125°C. However, the device can operate up to 150°C junction temperature.
  • To ensure stability, make sure the input and output capacitors are properly selected, the PCB layout is well-designed, and the device is operated within the recommended operating conditions. Additionally, a minimum of 10uF output capacitance is recommended to ensure stability.
  • The maximum output current capability of the NCP1392DDR2G is 2A. However, the device can deliver higher currents for short durations. It's recommended to check the thermal performance and power dissipation to ensure the device operates within its safe operating area.

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