Part Image

NCP156AAFCT105280T2G - onsemi

Description: Low Quiescent Current Typ. 100 uA; Output voltage slew rate control; Very Low Dropout Voltage 140 mV at 500 mA; Ultra Low Noise Typ. 6.5 uVRMS on OUT2; Available in CSP6 1.2 mm x 0.8 mm; N-MOS and P-MOS dual LDO

Download NCP156AAFCT105280T2G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
NCP156AAFCT105280T2G - onsemi PCB footprint - BGA - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE +
click to zoom
3D Models
NCP156AAFCT105280T2G - onsemi  - 3D model - BGA - WLCSP6, 1.20x0.80 CASE 567MV ISSUE +
click to zoom

NCP156AAFCT105280T2G Details

  • Manufacturer Part Number:

    NCP156AAFCT105280T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Manufacturer Package Code:

    567MV

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.15 V

  • Dropout Voltage1-Nom:

    0.07 V

  • Dropout Voltage2-Max:

    0.16 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.35 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e3

  • Length:

    1.2 mm

  • Load Regulation-Max:

    0.005%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Current2-Max:

    0.25 A

  • Output Voltage1-Max:

    1.0689 V

  • Output Voltage1-Min:

    1.0311 V

  • Output Voltage1-Nom:

    1.05 V

  • Output Voltage2-Max:

    2.856 V

  • Output Voltage2-Min:

    2.744 V

  • Output Voltage2-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.8 mm

NCP156AAFCT105280T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with multiple vias to the ground plane, and using a large copper area to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power handling capability according to the temperature derating curve provided in the datasheet.
  • The critical parameters to monitor during operation to prevent overheating are the device's junction temperature (TJ), input voltage, output current, and ambient temperature. Monitoring these parameters allows for early detection of potential overheating issues and enables proactive measures to prevent damage.
  • To select the correct input and output capacitors, consider the device's input voltage range, output voltage, and maximum output current. Choose capacitors with suitable voltage ratings, capacitance values, and ESR characteristics to ensure stable operation and minimize ripple voltage.
  • The recommended soldering and rework conditions for this device involve using a soldering iron with a temperature of 260°C (500°F) for 10 seconds or less, and a peak reflow temperature of 240°C (464°F) for 20 seconds or less. Follow the recommended soldering and rework procedures to prevent damage to the device.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NCP156AAFCT105280T2G Overview

Use the download button to access the NCP156AAFCT105280T2G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NCP15, or try a keyword search, such as Linear Regulator ICs

Parts related to NCP156AAFCT105280T2G

Showing 0 results