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NCP156ABFCT110280T2G - onsemi

Description: Low Quiescent Current Typ. 100 uA; Output voltage slew rate control; Very Low Dropout Voltage 140 mV at 500 mA; Ultra Low Noise Typ. 6.5 uVRMS on OUT2; Available in CSP6 1.2 mm x 0.8 mm; N-MOS and P-MOS dual LDO

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NCP156ABFCT110280T2G - onsemi PCB footprint - BGA - BGA - NCP156ABFCT110280T2G-1
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NCP156ABFCT110280T2G Details

  • Manufacturer Part Number:

    NCP156ABFCT110280T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-6

  • Manufacturer Package Code:

    567MV

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.15 V

  • Dropout Voltage1-Nom:

    0.07 V

  • Dropout Voltage2-Max:

    0.16 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.4 V

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e3

  • Length:

    1.2 mm

  • Load Regulation-Max:

    0.005%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Current2-Max:

    0.25 A

  • Output Voltage1-Max:

    1.1198 V

  • Output Voltage1-Min:

    1.0802 V

  • Output Voltage1-Nom:

    1.1 V

  • Output Voltage2-Max:

    2.856 V

  • Output Voltage2-Min:

    2.744 V

  • Output Voltage2-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.8 mm

NCP156ABFCT110280T2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good airflow around the device. A minimum of 2oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, and to operate the device within its specified temperature range. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, decreased performance, and potentially even device failure. It is crucial to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • To troubleshoot issues related to overvoltage protection (OVP) and undervoltage protection (UVP), check the input voltage levels, ensure proper configuration of the OVP and UVP thresholds, and verify that the device is not experiencing any faults or failures. Consult the datasheet and application notes for guidance on troubleshooting and fault detection.
  • To minimize electromagnetic interference (EMI) and ensure electromagnetic compatibility (EMC), follow proper PCB layout guidelines, use shielding and filtering components as necessary, and ensure that the device is properly grounded. Consult the datasheet and application notes for guidance on EMI and EMC considerations.

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NCP156ABFCT110280T2G Overview

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