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NCP160AFCS330T2G - onsemi

Description: Very Low Dropout 80mV at 250mA; Ultra High PSRR 98dB at 1kHz, 48dB at 100kHz; Ultra Low Output Noise 10 µVRMS; Operating Input Voltage Range 1.9V to 5.5V; Available in CSP4 0.35P and XDFN4 0.65P packages; Ultra Low Quiescent current 18 µA

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NCP160AFCS330T2G - onsemi - PCB symbol
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PCB Footprints
NCP160AFCS330T2G - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.64x0.64 CASE 567KA ISSUE B
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3D Models
NCP160AFCS330T2G - onsemi - 3D model - BGA - WLCSP4, 0.64x0.64 CASE 567KA ISSUE B
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NCP160AFCS330T2G Details

  • Manufacturer Part Number:

    NCP160AFCS330T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567KA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.145 V

  • Dropout Voltage1-Nom:

    0.08 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.9 V

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Length:

    0.64 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.45 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP160AFCS330T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Also, ensure that the input voltage is within the recommended range, and that the output voltage is properly regulated.
  • The critical components that affect the stability of the device are the input and output capacitors, the inductor, and the feedback resistors. Ensure that these components are of high quality and meet the recommended specifications.
  • To troubleshoot issues, start by checking the PCB layout and ensuring that it meets the recommended layout guidelines. Then, check the component values and ensure they meet the recommended specifications. Finally, use an oscilloscope to measure the output voltage and current to identify any anomalies.
  • The device has a maximum junction temperature rating of 150°C. Ensure that the device is properly cooled, and that the PCB layout is designed to dissipate heat efficiently. Also, ensure that the device is operated within the recommended temperature range.

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NCP160AFCS330T2G Overview

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