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NCP160AFCT330T2G - onsemi

Description: Very Low Dropout 80mV at 250mA; Ultra High PSRR 98dB at 1kHz, 48dB at 100kHz; Ultra Low Output Noise 10 µVRMS; Operating Input Voltage Range 1.9V to 5.5V; Available in CSP4 0.35P and XDFN4 0.65P packages; Ultra Low Quiescent current 18 µA

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PCB Footprints
NCP160AFCT330T2G - onsemi PCB footprint - BGA - BGA - WLCSP4, 0.64x0.64 CASE 567JZ ISSUE A
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NCP160AFCT330T2G - onsemi  - 3D model - BGA - WLCSP4, 0.64x0.64 CASE 567JZ ISSUE A
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NCP160AFCT330T2G Details

  • Manufacturer Part Number:

    NCP160AFCT330T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567JZ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.145 V

  • Dropout Voltage1-Nom:

    0.08 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.9 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.64 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP160AFCT330T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Also, ensure that the input voltage is within the recommended range, and that the output voltage is properly regulated.
  • Critical components to consider when designing a power supply using the NCP160AFCT330T2G include the input and output capacitors, inductors, and resistors. These components affect the stability, efficiency, and output voltage of the power supply.
  • To troubleshoot issues with the device, start by checking the input voltage, output voltage, and current ratings. Verify that the device is properly biased and that the PCB layout is correct. Use thermal imaging or temperature measurement tools to identify hotspots. Check for oscillations or instability in the output voltage using an oscilloscope.
  • Key considerations for EMI and EMC compliance include using a shielded enclosure, minimizing loop areas, and using EMI filters or common-mode chokes to reduce emissions. Ensure that the PCB layout is designed to minimize radiation and that the device is properly decoupled.

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NCP160AFCT330T2G Overview

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