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NCP1616A1DR2G - onsemi

Description: High Voltage Start-Up Circuit; Critical conduction mode with current controlled frequency foldback; Integrated Input Filter Capacitor (X2) Discharge Circuitry; Dynamic Response Enhancer; Soft Overvoltage Protection; -500 mA/+800 mA Drive Capability; AC Line Brownout Detection

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NCP1616A1DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-10 NB CASE 751BQ-1
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NCP1616A1DR2G Details

  • Manufacturer Part Number:

    NCP1616A1DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC-9 NB

  • Package Description:

    SOIC-10/9

  • Manufacturer Package Code:

    751BP

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    23 Weeks

  • Date Of Intro:

    2017-10-13

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    9.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G9

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP9/10,.24,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    26 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1616A1DR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and ensuring good airflow around the device. A 4-layer PCB with a solid ground plane and thermal vias is also recommended.
  • To ensure reliable start-up, make sure the input voltage is within the specified range, the output capacitor is properly sized, and the soft-start capacitor is correctly selected. Also, ensure that the input voltage rises monotonically during start-up.
  • The maximum allowed overshoot on the output voltage during start-up or transient events is typically 10-15% above the nominal output voltage. Exceeding this limit may damage the device or affect its reliability.
  • To select the right output inductor, consider the output current, switching frequency, and desired ripple current. A good starting point is to use the inductor selection guide provided in the datasheet, and then validate the selection through simulation and testing.
  • The recommended method for thermal monitoring and protection involves using a thermistor or thermal diode to monitor the device temperature, and implementing a thermal shutdown or warning mechanism to prevent overheating.

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NCP1616A1DR2G Overview

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