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NCP1618BDR2G - onsemi

Description: Multi-Mode Operation (CrM-CCM); Frequency Foldback / Soft-SKIP mode; PFC OK Signal; Jittering in CCM; Complete protection features: OCP, OVP, BO, BUV, Inrush detect…; Integrated EMI Filter Capacitor (X2) Discharge Circuitry

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NCP1618BDR2G - onsemi - PCB symbol
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NCP1618BDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-10 NB CASE 751BQ ISSUE A
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NCP1618BDR2G - onsemi - 3D model - Small Outline Packages - SOIC-10 NB CASE 751BQ ISSUE A
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NCP1618BDR2G Details

  • Manufacturer Part Number:

    NCP1618BDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-9 NB

  • Package Description:

    SSOP, SOP9/10,.25,40

  • Manufacturer Package Code:

    751BP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    35 V

  • Input Voltage-Min:

    9.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G9

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP9/10,.25,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Current-Max (Isup):

    4 mA

  • Surface Mount:

    YES

  • Switching Frequency-Max:

    130 kHz

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1618BDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1618BDR2G should prioritize thermal management, minimize noise coupling, and ensure good power supply decoupling. A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Place the input capacitors close to the VIN pin and the output capacitors close to the VOUT pin. Keep the switching node (SW pin) away from sensitive nodes and use a Kelvin connection for the output voltage sensing.
  • Choose input capacitors with a low ESR (Equivalent Series Resistance) and a high ripple current rating to minimize voltage drops and ensure stable operation. For the output capacitors, select ones with a low ESR and a high capacitance value to reduce output voltage ripple and improve transient response. The recommended capacitance values are 10uF to 22uF for the input capacitor and 22uF to 47uF for the output capacitor.
  • The maximum ambient temperature for the NCP1618BDR2G is 85°C. However, the device can operate up to 105°C with derating. It's essential to ensure good thermal management and heat dissipation to prevent overheating and ensure reliable operation.
  • The output voltage of the NCP1618BDR2G can be adjusted by using a resistive divider network between the VOUT pin and the GND pin. The feedback pin (FB) is connected to the center tap of the divider network. The output voltage can be calculated using the formula: VOUT = 0.8V x (R1 + R2) / R2, where R1 and R2 are the resistors in the divider network.
  • The minimum input voltage required for the NCP1618BDR2G to operate is 2.7V. However, the device can operate down to 2.5V with reduced performance and efficiency. It's recommended to ensure a minimum input voltage of 2.7V to ensure reliable operation and optimal performance.

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NCP1618BDR2G Overview

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