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NCP1618FDR2G - onsemi

Description: Multi-Mode Operation (CrM-CCM); Frequency Foldback / Soft-SKIP mode; PFC OK Signal; Jittering in CCM; Complete protection features: OCP, OVP, BO, BUV, Inrush detect…; Integrated EMI Filter Capacitor (X2) Discharge Circuitry

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NCP1618FDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−9 NB CASE 751BP ISSUE A
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NCP1618FDR2G - onsemi  - 3D model - Small Outline Packages - SOIC−9 NB CASE 751BP ISSUE A
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NCP1618FDR2G Details

  • Manufacturer Part Number:

    NCP1618FDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-9 NB

  • Manufacturer Package Code:

    751BP

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    37 Weeks

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    35 V

  • Input Voltage-Min:

    9.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G9

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP9/10,.25,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Current-Max (Isup):

    4 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NCP1618FDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NCP1618FDR2G should prioritize thermal management, minimize noise coupling, and ensure good power supply decoupling. A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Place the input capacitors close to the VIN pin and the output capacitors close to the VOUT pin. Keep the switching node (SW pin) away from sensitive nodes and use a Kelvin connection for the output voltage sensing.
  • Choose input capacitors with a low ESR (Equivalent Series Resistance) and a high ripple current rating to minimize voltage drops and ensure stable operation. For the output capacitors, select ones with a low ESR and a high capacitance value to reduce output voltage ripple and improve transient response. The recommended capacitance values are 10uF to 22uF for the input capacitor and 22uF to 47uF for the output capacitor.
  • The NCP1618FDR2G is rated for operation from -40°C to +125°C ambient temperature. However, the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance and reliability.
  • The NCP1618FDR2G has a built-in OVP and UVP feature. To implement OVP, connect a resistor divider network from the output voltage to the OVP pin, and to implement UVP, connect a resistor divider network from the input voltage to the UVP pin. The threshold voltage for OVP is 1.2V and for UVP is 0.8V. Adjust the resistor values to set the desired OVP and UVP thresholds.
  • The recommended soft-start time for the NCP1618FDR2G is 1ms to 5ms. A longer soft-start time can help reduce inrush current and output voltage overshoot during startup. However, a longer soft-start time may also increase the startup time and affect the overall system performance.

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