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NCP163AMX180TBG - onsemi

Description: LDO Regulator, 250 mA, Ultra-High PSRR, Ultra-Low Noise 1.8 V, Active Discharge

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NCP163AMX180TBG Details

  • Manufacturer Part Number:

    NCP163AMX180TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN-4

  • Manufacturer Package Code:

    711AJ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.25 V

  • Dropout Voltage1-Nom:

    0.18 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.2 V

  • JESD-30 Code:

    S-PDSO-N4

  • Length:

    1 mm

  • Line Regulation-Max:

    0.001188%

  • Load Regulation-Max(%):

    0.06723%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.04,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.43 mm

  • Surface Mount:

    YES

  • Technology:

    PMOS

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    1 mm

NCP163AMX180TBG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • The critical timing parameters include the switching frequency, rise and fall times, and dead time. These parameters should be carefully considered to ensure reliable operation and minimize electromagnetic interference (EMI).
  • Use a shielded enclosure, keep the PCB layout compact, and use EMI filters or common-mode chokes to reduce radiated emissions. Also, ensure that the device is operated within the recommended frequency range and that the PCB is designed to minimize radiation.
  • Use a high-speed oscilloscope and a current probe to measure the device's switching waveforms and current. Also, use a thermal camera or thermocouple to measure the device's temperature during operation.

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NCP163AMX180TBG Overview

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