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NCP167AFCT180T2G - onsemi

Description: Ultra Low Quiescent current 12 µA; Very Low Dropout 210mV at 700mA; Ultra High PSRR 85dB at 1 kHz, 63dB at 100 kHz; Ultra Low Output Noise 8.5 µVRMS; Operating Input Voltage Range 1.9V to 5.5V; Available in CSP4 0.35P and XDFN4 0.65P package

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NCP167AFCT180T2G - onsemi PCB footprint - BGA - BGA - NCP167AFCT180T2G
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NCP167AFCT180T2G - onsemi  - 3D model - BGA - NCP167AFCT180T2G
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NCP167AFCT180T2G Details

  • Manufacturer Part Number:

    NCP167AFCT180T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WLCSP-4

  • Manufacturer Package Code:

    567JZ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.45 V

  • Dropout Voltage1-Nom:

    0.315 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.9 V

  • JESD-30 Code:

    S-PBGA-B4

  • Length:

    0.64 mm

  • Line Regulation-Max:

    0.1296%

  • Load Regulation-Max:

    0.012582%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.7 A

  • Output Voltage1-Max:

    1.836 V

  • Output Voltage1-Min:

    1.764 V

  • Output Voltage1-Nom:

    1.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA4,2X2,14

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.33 mm

  • Surface Mount:

    YES

  • Technology:

    PMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    0.64 mm

NCP167AFCT180T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and mounted.
  • The critical timing parameters for the NCP167AFCT180T2G include the input rise and fall times, propagation delay, and output rise and fall times. These parameters are critical to ensure proper operation and to prevent issues like oscillations or instability.
  • To handle ESD protection for the NCP167AFCT180T2G, it's recommended to use a combination of ESD protection devices, such as TVS diodes or ESD arrays, and to follow proper PCB design and layout guidelines to minimize the risk of ESD damage.
  • The recommended operating conditions for the NCP167AFCT180T2G include an operating temperature range of -40°C to 150°C, a supply voltage range of 1.8V to 5.5V, and a maximum junction temperature of 150°C.

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