Description:Ultra Low Quiescent current 12 µA; Very Low Dropout 210mV at 700mA; Ultra High PSRR 85dB at 1 kHz, 63dB at 100 kHz; Ultra Low Output Noise 8.5 µVRMS; Operating Input Voltage Range 1.9V to 5.5V; Available in CSP4 0.35P and XDFN4 0.65P package
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of solder mask.
To ensure reliable start-up, ensure that the input voltage is within the recommended range, and that the output capacitor is properly sized. Also, ensure that the feedback network is properly designed to provide stable operation. A soft-start circuit can also be added to reduce inrush current during start-up.
When selecting the output inductor and capacitor values, consider the desired output voltage ripple, inductor core loss, and capacitor ESR. A good starting point is to choose an inductor with a high saturation current rating and a capacitor with a low ESR. The inductor value should be chosen to minimize core loss, while the capacitor value should be chosen to minimize output voltage ripple.
To optimize the feedback network, choose a compensation network that provides a stable gain and phase margin. A type-III compensation network is recommended, with a zero at the output pole frequency and a pole at the gain crossover frequency. The feedback resistors and capacitors should be chosen to provide a stable gain and phase margin.
For thermal design and heat sinking, consider the maximum operating temperature, thermal resistance, and power dissipation. Ensure good thermal conductivity between the device and the heat sink, and use a thermal interface material if necessary. The heat sink should be designed to provide good airflow and heat dissipation.
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NCP167AMX180TBG Overview
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