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NCP1729SN35T1G - onsemi

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NCP1729SN35T1G - onsemi - PCB symbol
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PCB Footprints
NCP1729SN35T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE M
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3D Models
NCP1729SN35T1G - onsemi - 3D model - SOT23 (6-Pin) - TSOP-6 CASE318G-02 ISSUE M
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NCP1729SN35T1G Details

  • Manufacturer Part Number:

    NCP1729SN35T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-6

  • Package Description:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHED CAPACITOR CONVERTER

  • Control Mode:

    VOLTAGE-MODE

  • Input Voltage-Max:

    6 V

  • Input Voltage-Min:

    1.15 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.025 A

  • Output Voltage-Max:

    -5.5 V

  • Output Voltage-Min:

    -1.15 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    DOUBLER INVERTER

  • Switching Frequency-Max:

    54 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.5 mm

NCP1729SN35T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable startup and shutdown, ensure that the input voltage rises and falls monotonically, and that the input voltage is within the recommended operating range. Also, ensure that the output capacitor is properly sized and placed close to the device to minimize parasitic inductance.
  • The recommended input capacitor is a 10uF to 22uF X5R or X7R ceramic capacitor, and the recommended output capacitor is a 10uF to 22uF X5R or X7R ceramic capacitor. The capacitor values may need to be adjusted based on the specific application requirements.
  • To minimize EMI, ensure that the device is placed away from noise-sensitive components, and that the PCB is designed to minimize radiation. Use a shielded inductor, and ensure that the input and output traces are routed away from each other. Also, consider adding EMI filters or shielding to the design.
  • The device has a maximum junction temperature of 150°C. Ensure that the device is operated within the recommended temperature range, and that the PCB is designed to minimize thermal resistance. Use a thermal pad or heat sink to dissipate heat, and ensure that the device is not exposed to extreme temperatures.

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NCP1729SN35T1G Overview

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