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NCP176AMX330TCG - onsemi

Description: Several Fixed Output Voltage Options and others available upon request in range from 0.7 V to 3.6 V; 1.4 V to 5.5 V Operating Input Voltage Range; Low Quiescent Current of Typ. 60 µA; Very Low Dropout: 130 mV Typ. at Iout = 0.5 A (2.5V version); High 75 dB at 1 kHz PSRR; Internal Soft-Start; ±0.8% Accuracy at Room temperature; Thermal Shutdown and Current Limit Protections; Stable with Small 1 µF Ceramic Capacitors

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NCP176AMX330TCG - onsemi PCB footprint - Other - Other - NCP176AMX330TCG-2
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NCP176AMX330TCG - onsemi  - 3D model - Other - NCP176AMX330TCG-2
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NCP176AMX330TCG Details

  • Manufacturer Part Number:

    NCP176AMX330TCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN-6

  • Package Description:

    XDFN-6

  • Manufacturer Package Code:

    711AT

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.165 V

  • Dropout Voltage1-Nom:

    0.11 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    1.2 mm

  • Line Regulation-Max:

    0.0135%

  • Load Regulation-Max:

    0.005%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    3.3495 V

  • Output Voltage1-Min:

    3.2505 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.05,16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    0.8%

  • Width:

    1.2 mm

NCP176AMX330TCG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of solder mask.
  • To ensure reliable startup and shutdown, ensure that the input voltage rises and falls monotonically, and that the input voltage is within the recommended operating range. Avoid sudden changes in input voltage, and ensure that the output voltage is properly decoupled with capacitors.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible, and should be rated for the maximum input voltage.
  • To minimize EMI, ensure that the device is placed in a shielded area, and that the input and output traces are kept short and away from sensitive circuits. Use a common-mode choke or ferrite bead on the input and output lines, and ensure that the device is properly decoupled with capacitors.
  • The maximum ambient temperature for reliable operation is 85°C. However, the device can operate up to 125°C with derating. Ensure that the device is properly heat-sinked and that the thermal pad is properly connected to a heat sink or thermal pad.

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