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NCP177AMX120TCG - onsemi

Description: 1.6 V to 5.5 V Operating Input Voltage Range; Several Fixed Output Voltage Options and others available upon request in range from 0.7 V to 3.6 V; Low Quiescent Current of Typ. 60 µA; Very Low Dropout: 200 mV Typ. at Iout = 0.5 A (1.8V version); High 75 dB at 1 kHz PSRR; Internal Soft-Start; ±0.8% Accuracy at Room temperature; Thermal Shutdown and Current Limit Protections; Stable with Small 1 µF Ceramic Capacitors

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NCP177AMX120TCG Details

  • Manufacturer Part Number:

    NCP177AMX120TCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    XDFN-4

  • Package Description:

    XDFN-4

  • Manufacturer Package Code:

    711AJ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.6 V

  • JESD-30 Code:

    S-PDSO-N4

  • Length:

    1 mm

  • Line Regulation-Max:

    0.00468%

  • Load Regulation-Max:

    0.01%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    1.212 V

  • Output Voltage1-Min:

    1.176 V

  • Output Voltage1-Nom:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC4,.04,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.43 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1 mm

NCP177AMX120TCG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane can also help to reduce thermal resistance.
  • To ensure reliable operation over the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and mounted. Additionally, consider using a thermally conductive adhesive or thermal tape to improve heat transfer.
  • Critical parameters to monitor during operation include input voltage, output voltage, output current, and temperature. Monitoring these parameters can help prevent overheating, overvoltage, and overcurrent conditions that can damage the device.
  • To handle ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and ensure that the device is properly grounded during handling and assembly. Additionally, consider using ESD protection devices, such as TVS diodes, in the circuit design.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or leads. Use anti-static wrist straps, mats, or bags to prevent ESD damage. Avoid bending or flexing the leads, and ensure that the device is properly packaged and sealed during transportation.

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