NCP1937A2DR2G footprint, schematic symbol and 3D model by onsemi

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NCP1937A2DR2G - onsemi PCB footprint - Other - Other - NCP1937A2DR2G-2

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Part Number NCP1937A2DR2G
Manufacturer onsemi
Pin Count 17
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - NCP1937A2DR2G-2
Released Date Sep 8, 2023
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

NCP1937A2DR2G Details

Manufacturer Part Number:
NCP1937A2DR2G
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SOIC20 NB LESS PINS 2, 4 & 19
Package Description:
SOIC20 NB LESS PINS 2, 4 & 19-17
Pin Count:
17
Manufacturer Package Code:
751BS
Country Of Origin:
Philippines
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
24 Weeks
Manufacturer:
onsemi
Analog IC - Other Type:
POWER FACTOR CONTROLLER
Control Mode:
CURRENT-MODE
Control Technique:
RESONANT CONTROL
Input Voltage-Max:
30 V
Input Voltage-Min:
9 V
Input Voltage-Nom:
12 V
JESD-30 Code:
R-PDSO-G17
JESD-609 Code:
e3
Length:
9.9 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
17
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
LSSOP
Package Equivalence Code:
SOP17/20,.25,40
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.7 mm
Supply Current-Max (Isup):
5.2 mA
Surface Mount:
YES
Switcher Configuration:
BUCK-BOOST
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Pitch:
1 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.9 mm

NCP1937A2DR2G Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the thermal pad is connected to a solid ground plane.
To ensure the device is properly biased, make sure to connect the EN pin to a stable voltage source, and ensure that the input voltage (VIN) is within the recommended operating range. Also, ensure that the output voltage (VOUT) is set to the desired value using the FB pin and the resistive divider network.
The critical components that affect the device's stability and performance include the input capacitor (CIN), output capacitor (COUT), and the resistive divider network (R1 and R2) that sets the output voltage. Ensure that these components are selected and placed correctly to ensure stable operation.
To troubleshoot issues with the device, start by checking the PCB layout and component placement for any errors or omissions. Verify that the input and output capacitors are properly selected and placed. Check the resistive divider network for correct values and placement. Also, ensure that the device is properly biased and that the input voltage is within the recommended operating range.
To ensure EMI and EMC compliance, consider the following: use a shielded enclosure, keep the PCB layout compact, use a common mode choke or ferrite bead on the input, and ensure that the output filter components are properly selected and placed. Also, ensure that the device is properly decoupled and that the input and output cables are properly shielded.

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NCP1937A2DR2G Overview

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