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NCP300LSN33T1G - onsemi

Description: ON Semiconductor NCP300LSN33T1G, Voltage Supervisor, 0.9 → 4.9 V, 5-Pin TSOP

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Symbol
NCP300LSN33T1G - onsemi - PCB symbol
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PCB Footprints
NCP300LSN33T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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3D Models
NCP300LSN33T1G - onsemi - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NCP300LSN33T1G Details

  • Manufacturer Part Number:

    NCP300LSN33T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.0013 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCP300LSN33T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Ensure that the device is operated within the recommended temperature range (–40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind.
  • Yes, the NCP300LSN33T1G is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards or customer requirements.
  • Use a systematic approach to troubleshoot issues. Check the device's pinout and connections, ensure proper power supply and decoupling, and verify that the device is operated within its recommended specifications. Consult the datasheet and application notes for guidance.

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NCP300LSN33T1G Overview

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Part Image NCP300LSN33T1 onsemi

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