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NCP302LSN30T1G - onsemi

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Symbol
NCP302LSN30T1G - onsemi - PCB symbol
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PCB Footprints
NCP302LSN30T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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3D Models
NCP302LSN30T1G - onsemi - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NCP302LSN30T1G Details

  • Manufacturer Part Number:

    NCP302LSN30T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.0013 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCP302LSN30T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal interface material to reduce the junction temperature. Monitor the device's thermal shutdown threshold (typically 170°C) to prevent overheating.
  • The NCP302LSN30T1G has internal ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the NCP302LSN30T1G is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, ensure that the device is used within its recommended operating conditions and that the system design meets the required reliability and safety standards.
  • Check the input voltage, output voltage, and feedback resistors for correct values and connections. Verify that the device is properly decoupled and that the output capacitor is suitable for the application. Consult the datasheet and application notes for guidance on troubleshooting and design considerations.

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NCP302LSN30T1G Overview

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