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NCP303LSN23T1G - onsemi

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PCB Footprints
NCP303LSN23T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NCP303LSN23T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02
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NCP303LSN23T1G Details

  • Manufacturer Part Number:

    NCP303LSN23T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.0013 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.3V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCP303LSN23T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • The device requires a stable input voltage (VIN) and a proper bias voltage (VBIAS) to operate correctly. Ensure VIN is within the recommended range (2.7V to 5.5V) and VBIAS is set to 1.25V ± 5% for optimal performance.
  • A 1-10 μF ceramic capacitor (X5R or X7R dielectric) is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
  • The POR and BOR features are enabled by default. To use these features, ensure the reset pin (RST) is connected to a suitable pull-up resistor (1 kΩ to 10 kΩ) and a capacitor (10 nF to 100 nF) to filter out noise.
  • The NCP303LSN23T1G is rated for operation from -40°C to 125°C (junction temperature). However, the device's performance and reliability may degrade if operated at extreme temperatures for extended periods.

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NCP303LSN23T1G Overview

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Part Image NCP303LSN23T1 onsemi

Voltage Supervisor/Reset IC, Fixed, 1 Channel, +2.3V, CMOS, PDSO5