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NCP303LSN29T1G - onsemi

Description: ON SEMICONDUCTOR - NCP303LSN29T1G - Voltage Detector, Active-Low Reset, 0.8V-10Vin, TSOP-5

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PCB Footprints
NCP303LSN29T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5-1
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3D Models
NCP303LSN29T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5-1
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NCP303LSN29T1G Details

  • Manufacturer Part Number:

    NCP303LSN29T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE DETECTOR

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.0013 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.9V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

NCP303LSN29T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to keep the junction temperature below the maximum rating.
  • The NCP303LSN29T1G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials and equipment, and ensure that the device is handled in an ESD-controlled environment.
  • Yes, the NCP303LSN29T1G is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is suitable for use in harsh environments.
  • Use a systematic approach to troubleshoot issues, starting with a review of the device's operating conditions, power supply, and PCB layout. Check for signs of overheating, electrical overstress, or other environmental factors that may be contributing to the issue.

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NCP303LSN29T1G Overview

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Part Image NCP303LSN29T1 onsemi

Voltage Supervisor/Reset IC, Fixed, 1 Channel, +2.9V, CMOS, PDSO5